Electronic component manufacturing apparatus and electronic component manufacturing method

ABSTRACT

An electronic component manufacturing method includes the steps of preparing at least one electronic component chip having a first surface and a second surface opposite each other; holding the electronic component chip between a first plate and a second plate such that the first surface is in contact with a first elastic layer of the first plate and the second surface is in contact with a second elastic layer of the second plate; and turning the electronic component chip by relatively moving the first and second plates in a planar direction thereof using a planar movement mechanism and moving the first and second plates in accordance with a turning path of the electronic component chip using the planar movement mechanism and a vertical movement mechanism.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to electronic component manufacturingapparatuses and electronic component manufacturing methods used, forexample, to apply conductive paste to a plurality of end faces ofelectronic component chips. In particular, the present invention relatesto an electronic component manufacturing apparatus in which electroniccomponent chips are held between a pair of opposite plates and turned byrelatively moving the pair of plates, and also relates to an electroniccomponent manufacturing method using the electronic componentmanufacturing apparatus.

2. Description of the Related Art

In an electronic component, such as a monolithic capacitor, electrodesare formed on a plurality of surfaces of an electronic component chip.As examples of electrode forming methods, methods for applying andbaking conductive paste have been widely used. For efficient applicationof conductive paste, a variety of methods have been proposed.

Japanese Unexamined Patent Application Publication No. 2000-299145discloses a method in which electrodes are formed on about four sidefaces of an electronic component chip having a substantiallyquadrangular prismatic shape. For application of conductive paste todifferent side faces of such an electronic component chip, this methoduses an electronic component manufacturing apparatus illustrated in FIG.10.

In an electronic component manufacturing apparatus 1001 illustrated inFIG. 10, an elastic material layer 1003 is formed on a lower surface ofa retaining plate 1002. A holder plate 1004 is disposed below theretaining plate 1002. The holder plate 1004 is made of elastic materialand provided with a through hole 1004 a. An electronic component chip1005 is press-fitted into and held in the through hole 1004 a.

As illustrated in FIG. 10, the electronic component chip 1005 is heldbetween the elastic material layer 1003 and the holder plate 1004. Inthis state, the retaining plate 1002 is moved, as indicated by an arrow,in a planar direction thereof with respect to the holder plate 1004. Asa result, the electronic component chip 1005 is turned and press-fittedinto the through hole 1004 a of the holder plate 1004. Thus, one sideface of the electronic component chip 1005 can be exposed on the uppersurface of the holder plate 1004. This facilitates application ofconductive paste to the exposed side face of the electronic componentchip 1005.

Japanese Unexamined Patent Application Publication No. 2000-299145states that electrodes can be formed on about four side faces of theelectronic component chip 1005 by repeating the step of turning theelectronic component chip 1005 using the retaining plate 1002 and theholder plate 1004.

Japanese Unexamined Patent Application Publication No. 2010-141145discloses a technique which also involves turning an electroniccomponent chip. In the technique disclosed in this document, one sideface of an electronic component chip is held to an adhesive surface of afirst elastic member by adhesive force. In this state, a paste layer isformed on the other side face of the electronic component chip. Then, asecond elastic member having a non-adhesive surface is pressed intocontact with the electronic component chip and slid in a planardirection thereof with respect to the first elastic member. This allowsthe electronic component chip to be turned about 180 degrees. After theelectronic component chip is turned about 180 degrees, the other sideface of the electronic component chip is held to the adhesive surface ofthe first elastic member. Thus, a paste layer can be formed on the oneside face of the electronic component chip.

In the electronic component manufacturing apparatus described inJapanese Unexamined Patent Application Publication No. 2000-299145, theelectronic component chip 1005 is turned about 90 degrees andpress-fitted into the through hole 1004 a of the holder plate 1004. Thismeans that for application of paste to another side face, the electroniccomponent chip 1005 needs to be taken out of the through hole 1004 a andturned again.

Japanese Unexamined Patent Application Publication No. 2010-141145describes the fact that an electronic component chip is turned about 180degrees for application of electrode paste to opposite side faces of theelectronic component chip. However, Japanese Unexamined PatentApplication Publication No. 2010-141145 does not describe in detail anyspecific method or apparatus for turning the electronic component chip.

Japanese Unexamined Patent Application Publication No. 2010-141145describes the technique in which electronic component chips are pressedinto contact with an elastic member having an adhesive surface. In thistechnique, as the size of the electronic component chips decreases, itbecomes difficult to accurately turn the electronic component chips dueto, for example, deformation of the elastic member. Moreover, it isdifficult in practice to check whether such small electronic componentchips have been properly turned, because of a small distance betweenelastic members on both sides of the electronic component chips.

SUMMARY OF THE INVENTION

In view of the current circumstances of the related art described above,an object of the present invention is to provide an electronic componentmanufacturing apparatus and an electronic component manufacturing methodusing the electronic component manufacturing apparatus in which it ispossible to reliably turn electronic component chips even if they aresmall in size.

An electronic component manufacturing apparatus according to preferredembodiments of the present invention includes a first plate having afirst elastic layer on one side thereof; a second plate having a secondelastic layer on one side thereof; a planar movement mechanismconfigured to relatively move the first and second plates in a planardirection thereof in a state where at least one electronic componentchip adhering, at one surface thereof, to the first elastic layer isheld between the first and second elastic layers facing each other; anda vertical movement mechanism configured to move, in conjunction withthe planar movement mechanism, at least one of the first and secondplates in the planar direction and a vertical direction in accordancewith a turning path of the electronic component chip turned between thefirst and second elastic layers.

In a specific aspect of the electronic component manufacturing apparatusaccording to the preferred embodiments of the present invention, theplanar movement mechanism and the vertical movement mechanism each mayhave a motor as a drive source and each may be provided with a detectingmechanism that detects changes in torque of the motor.

An electronic component manufacturing method according to preferredembodiments of the present invention is an electronic componentmanufacturing method using the electronic component manufacturingapparatus configured in accordance with the preferred embodiments of thepresent invention, the method including the steps of preparing at leastone electronic component chip having a first surface and a secondsurface opposite each other; holding the electronic component chipbetween the first and second plates such that the first and secondsurfaces are in contact with the first and second elastic layers,respectively; and turning the electronic component chip by relativelymoving the first and second plates in the planar direction using theplanar movement mechanism and moving the first and second plates inaccordance with a turning path of the electronic component chip usingthe planar movement mechanism and the vertical movement mechanism.

In a specific aspect, the electronic component manufacturing methodaccording to the preferred embodiments of the present invention mayfurther include the steps of, before relatively moving the first andsecond plates in the planar direction, bringing the first and secondplates closer to each other by driving the vertical movement mechanismsuch that the first and second surfaces of the electronic component chipdig into the first and second elastic layers, respectively; relativelymoving the first and second plates in the planar direction by apredetermined distance smaller than or equal to maximum displacements ofthe first and second plates in the vertical direction, the displacementsbeing made when the first and second plates are brought closer to eachother; and after relatively moving the first and second plates in theplanar direction by the predetermined distance, turning the electroniccomponent chip using the planar movement mechanism and the verticalmovement mechanism such that the electronic component chip is turnedalong the turning path of the electronic component chip.

In another specific aspect of the electronic component manufacturingmethod according to the preferred embodiments of the present invention,the planar movement mechanism and the vertical movement mechanism eachmay have a motor as a drive source, and each may detect a torque of themotor using a detecting mechanism.

In the electronic component manufacturing apparatus and the electroniccomponent manufacturing method according to the preferred embodiments ofthe present invention, in a state where at least one electroniccomponent chip having a pair of opposite surfaces is held between thefirst and second plates, with one surface adhering to the adhesivesurface of the first plate and the other surface being in contact withthe second plate, at least one of the first and second plates can bemoved in accordance with the turning path of the electronic componentchip. It is thus possible to turn the electronic component chip. Thatis, since it is possible to reliably turn the electronic component chipalong its turning path, the electronic component chip can be properlyturned even if the electronic component chip is small in size or even ifthe elastic layers are deformed by being pressed into contact therewithby the electronic component chip.

The electronic component manufacturing apparatus and the electroniccomponent manufacturing method according to the preferred embodiments ofthe present invention are suitable for use in the process of applyingpaste to opposite end faces of electronic component chips, and make itpossible to reliably apply paste to both end faces of the electroniccomponent chips.

Other features, elements, characteristics and advantages of the presentinvention will become more apparent from the following detaileddescription of preferred embodiments of the present invention withreference to the attached drawings.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic front view for explaining a step of turningelectronic component chips by moving a second plate according to apreferred embodiment of the present invention, FIG. 1B is a partialcutaway enlarged front cross-sectional view illustrating a relationshipbetween an electronic component chip and first and second elasticlayers, and FIG. 1C is a schematic front view illustrating theelectronic component chips after they are turned about 90 degrees;

FIG. 2A is a perspective view of an electronic component chip to beturned by an electronic component manufacturing method according to thepreferred embodiment of the present invention, and FIG. 2B is aperspective view of the electronic component chip, with both end facesthereof coated with conductive pastes by the electronic componentmanufacturing method;

FIG. 3A to FIG. 3C are schematic front views for explaining theelectronic component manufacturing method according to the preferredembodiment of the present invention;

FIG. 4 is a schematic front view for explaining a step of turning theelectronic component chip such that an angle θ is changed from about 90degrees to about 0 degrees according to the preferred embodiment of thepresent invention;

FIG. 5 is a graph showing temporal changes in torque value of a motor ofa vertical movement mechanism according to the preferred embodiment ofthe present invention;

FIG. 6 is a schematic front view for explaining a step of turning theelectronic component chip about 90 degrees after turning it about 90degrees according to the preferred embodiment of the present invention;

FIG. 7A to FIG. 7C are schematic front views for explaining a process inwhich electronic component chips having been turned about 90 degrees arefurther turned about 90 degrees in the electronic componentmanufacturing method according to the preferred embodiment of thepresent invention;

FIG. 8 is a graph showing a relationship between turning angle and thetravel distances of first and second plates in Z-axis and X-axisdirections for realizing a turning path α according to the preferredembodiment of the present invention;

FIG. 9A and FIG. 9B are partial cutaway front cross-sectional views forexplaining a problem with a method of related art in which an electroniccomponent chip is held and turned between a pair of elastic layers, andFIG. 9C is a schematic partial cutaway front cross-sectional view forexplaining a step of turning an electronic component chip held betweenfirst and second elastic layers according to the preferred embodiment ofthe present invention; and

FIG. 10 is a partial cutaway front cross-sectional view for explaining amethod for turning an electronic component chip according to anelectronic component manufacturing method of related art.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The present invention will be clarified by describing specific preferredembodiments of the present invention with reference to the drawings.

In an electronic component manufacturing method of the present preferredembodiment, conductive pastes are applied to and baked on both end facesof an electronic component chip 1 illustrated in FIG. 2A. The electroniccomponent chip 1 is a ceramic sintered body having a plurality ofinternal electrodes 2. In the ceramic sintered body, the internalelectrodes 2 illustrated in FIG. 2A and a plurality of other internalelectrodes are alternately stacked, with ceramic layers interposedbetween adjacent internal electrodes. The plurality of internalelectrodes 2 are exposed to an end face 1 a of the electronic componentchip 1. The plurality of other internal electrodes alternately stackedwith the plurality of internal electrodes 2, as described above, areexposed to an end face 1 b of the electronic component chip 1. The endface 1 a and the end face 1 b correspond to a first surface and a secondsurface, respectively, of the present invention.

As illustrated in FIG. 2B, in the present preferred embodiment,conductive pastes 3 and 4 are applied to cover the end faces 1 a and 1b, respectively. The electronic component chip is turned for applicationof the conductive pastes 3 and 4 thereto. Specifically, afterapplication of the conductive paste 3 to the end face 1 a, theelectronic component chip 1 is turned about 180 degrees to apply theconductive paste 4 to the end face lb. The step of turning theelectronic component chip 1 will now be described in detail.

An electronic component manufacturing apparatus 11 illustrated in FIG.3A is used in the present preferred embodiment. The electronic componentmanufacturing apparatus 11 includes a first plate 12. The first plate 12includes a support plate portion 13 made of metal and a first elasticlayer 14 formed on a lower surface of the support plate portion 13. Thefirst elastic layer 14 has an adhesive force. A second plate 15 isdisposed below the first plate 12. The second plate 15 includes asupport plate portion 16 made of metal and a second elastic layer 17formed on an upper surface of the support plate portion 16. In thepresent preferred embodiment, the first plate 12 is connected to avertical movement mechanism 18, which moves the first plate 12 upwardand downward.

The second plate 15 is connected to a planar movement mechanism 19,which moves the second plate 15 in a planar direction thereof.

The vertical movement mechanism 18 may be a known reciprocating drivesource. For example, such a reciprocating drive source may be one whichincludes a motor and a drive-direction converting mechanism connected tothe motor. The drive-direction converting mechanism is configured toconvert the direction of rotary drive force of the motor into areciprocating direction. Alternatively, a reciprocating drive source,such as an air cylinder or a hydraulic cylinder, may be used. For easycontrol of the travel distance, however, it is preferable that areciprocating drive source including a motor be used.

The planar movement mechanism 19 may also be a reciprocating drivesource, as in the case of the vertical movement mechanism 18. Again,since the travel distance of the second plate 15 can be controlled withgreat precision, it is preferable that a reciprocating drive sourceincluding a motor and a drive-direction converting mechanism be used. Inthe present preferred embodiment, the vertical movement mechanism 18 andthe planar movement mechanism 19 each include a motor and adrive-direction converting mechanism connected to the motor.

In the electronic component manufacturing method of the presentpreferred embodiment, as illustrated in FIG. 3A, a plurality ofelectronic component chips 1 are held on the lower surface of the firstelastic layer 14. In other words, the end faces 1 b of the electroniccomponent chips 1 are secured to the lower surface of the first elasticlayer 14 by adhesive force. While not shown in FIG. 3A, a conductivepaste is applied in advance to the end faces 1 a located below the endfaces 1 b. Specifically, by dipping the electronic component chips 1secured to the first plate 12 into a conductive paste and raising them,the conductive paste is applied to the end faces 1 a of the electroniccomponent chips 1. In the present preferred embodiment, the electroniccomponent chips 1 are held between the first and second plates 12 and 15and turned about 180 degrees, so that the end faces 1 b of theelectronic component chips 1 are exposed.

For this, first, the first plate 12 illustrated in FIG. 3A is lowered bythe vertical movement mechanism 18.

Thus, as illustrated in FIG. 3B, the end faces 1 a of the electroniccomponent chips 1 are secured to the second elastic layer 17 of thesecond plate 15. This means that the plurality of electronic componentchips 1 are held between the first and second plates 12 and 15.

Next, the vertical movement mechanism 18 is driven to press the firstplate 12 downward. As illustrated in FIG. 3C, this elastically deformsthe first and second elastic layers 14 and 17 and causes the end faces 1a and 1 b of the electronic component chips 1 to dig into the second andfirst elastic layers 17 and 14, respectively.

Next, as illustrated in FIG. 1A, the second plate 15 is slightly movedby the planar movement mechanism 19 laterally as indicated by arrow A inFIG. 1A. This causes the electronic component chips 1 to be inclined inan oblique direction. Since the end faces 1 a and 1 b of the electroniccomponent chips 1 have dug into the second and first elastic layers 17and 14, respectively, the second and first elastic layers 17 and 14 aredeformed by the lateral movement of the second plate 15. As illustratedin FIG. 1B, a protrusion 14 a is formed in the first elastic layer 14 bythe movement of the second plate 15 in the direction of arrow A in FIG.1A.

A travel distance by which the second plate 15 is slightly moved in thedirection of arrow A, as described above, is preferably smaller than orequal to maximum elastic displacements of the first and second elasticlayers 14 and 17.

The maximum elastic displacements of the first and second elastic layers14 and 17 refer to the maximum amounts by which the first and secondelastic layers 14 and 17 are elastically deformed when the electroniccomponent chips 1 are pressed and held between the first and secondelastic layers 14 and 17. That is, when the electronic component chips 1are pressed and held between the first and second elastic layers 14 and17 firmly to a maximum extent that does not cause any damage to theelectronic component chips 1, a displacement X in FIG. 1B is a maximumelastic displacement of the first elastic layer 14, and a displacement Yin FIG. 1B is a maximum elastic displacement of the second elastic layer17.

The electronic component chips 1 can be reliably turned (as describedbelow) by moving the second plate 15 in the direction of arrow A by adistance smaller than the maximum elastic displacements X and Y of thefirst and second elastic layers 14 and 17, respectively, and larger thanor equal to about 40% of a width W of the electronic component chips 1.The electronic component chips 1 may not be turned completely if thesecond plate 15 is moved by a distance smaller than about 40% of thewidth W of the electronic component chips 1.

The second plate 15 is further moved in the planar direction, that is,in the direction of arrow A in FIG. 1A with respect to the first plate12. Additionally, the first plate 12 is moved in accordance with aturning path of the electronic component chips 1. As schematicallyillustrated in FIG. 4, when the electronic component chip 1 positionedas indicated by a solid line is turned to a position indicated by brokenline B and further to a position indicated by broken line C, theelectronic component chip 1 is turned about a ridge 1 c located at therear of the end face 1 a in the direction of travel of the second plate15. As illustrated in FIG. 1B, in the present preferred embodiment, theprotrusion 14 a is formed in the first elastic layer 14, a depression 17a is formed in the second elastic layer 17, and the electronic componentchip 1 is retained by an inner wall of the depression 17 a locatedrearward in the direction of travel of the second plate 15. Thus, theelectronic component chip 1 is reliably turned about the ridge 1 c. Theturning path of the electronic component chip 1 is a path α drawn by aridge 1 d located diagonally opposite the ridge 1 c in FIG. 4. If thedimensions of the electronic component chip 1 to be turned are known,the path α can be easily determined, as the electronic component chip 1has a substantially rectangular parallelepiped shape.

FIG. 8 is a graph showing a relationship between turning angle andtravel distances in X-axis and Z-axis directions for realizing theturning path α determined as described above. Note that the traveldistance in the X-axis direction is a distance by which the second plate15 is moved in the planar direction by the planar movement mechanism 19,and the travel distance in the Z-axis direction is a distance by whichthe first plate 12 is moved in a vertical direction by the verticalmovement mechanism 18.

By varying the travel distances in the X-axis and Z-axis directions asshown in FIG. 8, the electronic component chips 1 each can be turnedalong the turning path α such that the turning angle indicated by thehorizontal axis is realized.

The vertical movement mechanism 18 and the planar movement mechanism 19are driven to move the first and second plates 12 and 15 such that theelectronic component chips 1 each are turned along the turning path αdetermined as described above. The electronic component chips 1 each canthus be reliably turned about 90 degrees about the ridge 1 c. Afterbeing turned about 90 degrees, the electronic component chips 1 arepositioned as illustrated in FIG. 1C. Since the first and second plates12 and 15 are moved to turn the electronic component chips 1 along theturning path α, the electronic component chips 1 are reliably heldbetween the first and second plates 12 and 15.

To more reliably turn the electronic component chips 1 along the turningpath α, it is preferable to detect a torque of a motor included in eachof the vertical movement mechanism 18 and the planar movement mechanism19 and control the travel distances of the first and second plates 12and 15.

If the dimensions of the electronic component chips 1 are known, thefirst and second plates 12 and 15 can be moved to turn the electroniccomponent chips 1 along the turning path α. Here, the travel distancesof the first and second plates 12 and 15 are proportional to torquevalues of the motors included in the vertical movement mechanism 18 andthe planar movement mechanism 19. Therefore, it is preferable thattorque detecting mechanisms 20 and 21 be connected to the verticalmovement mechanism 18 and the planar movement mechanism 19,respectively, to detect torque values of the motors.

FIG. 5 is a graph showing temporal changes in torque value of thevertical movement mechanism 18. As shown in FIG. 5, the torque value ofthe motor changes as the electronic component chips 1 turn. The changesin torque value have a correlation to the turning path α when theelectronic component chips 1 are turned along the turning path α.

Therefore, if changes in detected torque value do not coincide withchanges in torque value determined in advance for realizing the turningpath α, the output of the motor in the vertical movement mechanism 18can be adjusted to achieve changes of the torque value determined inadvance for realizing the turning path α.

Thus, by detecting the torque value of the motor and adjusting theoutput of the motor in accordance with the detected torque value, it ispossible to turn the electronic component chips 1 such that the turningpath α can be drawn with greater precision.

The graph of FIG. 5 shows changes in torque of the vertical movementmechanism 18. It is more preferable to also detect changes in torque ofthe planar movement mechanism 19 in a manner similar to that describedabove, so that changes in torque values of both the vertical movementmechanism 18 and the planar movement mechanism 19 can be used to controlthe turning path α of the electronic component chips 1.

As described above, the electronic component chips 1 can be turned about90 degrees to a position illustrated in FIG. 1C.

In the description made with reference to FIG. 1A to FIG. 4, theelectronic component chip 1 is turned to change an angle θ in FIG. 4from about 90 degrees to about 0 degrees. In the present preferredembodiment, as illustrated in FIG. 6, the electronic component chip 1 isturned further to change an angle φ from about 0 degrees to about 90degrees. In this case, a turning path β is drawn by a ridge 1 f.

Specifically, as illustrated in FIG. 7A, the first plate 12 is loweredby the vertical movement mechanism 18 again to cause the electroniccomponent chips 1 to dig into the first and second elastic layers 14 and17. Next, the second plate 15 is slightly moved in the direction ofarrow A. This travel distance is smaller than or equal to maximumelastic displacements of the first and second elastic layers 14 and 17.Again, protrusions and depressions are formed in the first and secondelastic layers 14 and 17. The electronic component chips 1 each are thusreliably turned about a ridge 1 e (see FIG. 6) in contact with the innerwall of the corresponding depression.

For turning the electronic component chips 1, the planar movementmechanism 19 is driven to further move the second plate 15 in thedirection of arrow A. Additionally, the first plate 12 and the secondplate 15 are moved by the vertical movement mechanism 18 and the planarmovement mechanism 19, respectively, such that the turning path βillustrated in FIG. 6 is drawn. Thus, as illustrated in FIG. 7B and FIG.7C, the electronic component chips 1 are turned to draw the turning pathβ, so that the angle φ can be changed from about 0 degrees to about 90degrees. In other words, the electronic component chips can be turnedabout 180 degrees from the initial state illustrated in FIG. 3A.

As described above, with the electronic component manufacturing methodof the present preferred embodiment, the electronic component chips 1can be reliably turned about 180 degrees.

Therefore, when the vertical movement mechanism 18 raises the firstplate 12 from the position illustrated in FIG. 7C, the end faces 1 b ofthe electronic component chips 1 can be exposed while the electroniccomponent chips 1 are held on the lower surface of the first plate 12.Thus, a conductive paste can be easily applied to the end faces 1 b ofthe electronic component chips 1.

As mentioned above, Japanese Unexamined Patent Application PublicationNo. 2010-141145 describes the fact that an electronic component chip isturned about 180 degrees, but does not describe in detail any specificmethod or apparatus for turning the electronic component chip about 180degrees.

As illustrated in FIG. 9A, if an electronic component chip 123 is simplyheld between elastic layers 121 and 122 facing each other and then, theelastic layer 122 is moved with respect to the elastic layer 121 in theplanar direction as indicated by an arrow, cracking or chipping mayoccur in the electronic component chip 123. This tends to occur when awidth W and a thickness T of the electronic component chip 123 differfrom each other. This is because if the width W and the thickness T aredifferent, the electronic component chip 123 cannot be easily turnedfurther from the position illustrated in FIG. 9A. This may lead tooccurrence of cracking or chipping in the electronic component chip 123.

If the electronic component chip 123 is to be turned about 90 degrees orabout 180 degrees, it may be possible to move the elastic layers 121 and122 such that a turning path is drawn. However, as illustrated in FIG.9B, if the electronic component chip 123 is simply held between theelastic layers 121 and 122 and if the elastic layers 121 and 122 aresimply moved to realize such a turning path, the electronic componentchip 123 may not be properly turned. This is because a ridge 123 a aboutwhich the electronic component chip 123 is turned may not be firmlyretained by the elastic layer 122 and may slide over the upper surfaceof the elastic layer 122.

In contrast to this, in the preferred embodiment described above, theelectronic component chip 1 is pressed into contact with the firstelastic layer 14 and the second elastic layer 17 in advance.Additionally, the first elastic layer 14 and the second elastic layer 17are relatively moved in the planar direction, in advance, by a distancesmaller than or equal to the maximum elastic displacements of the firstand second elastic layers 14 and 17. Thus, since the first and secondelastic layers 14 and 17 remain deformed as illustrated in FIG. 9C, theprotrusion 14 a is formed in the first elastic layer 14. Therefore, theridge 1 d of the electronic component chip 1 is retained by theprotrusion 14 a. At the same time, the ridge 1 c is retained by thedepression 17 a. The electronic component chip 1 can thus be reliablyturned about the ridge 1 c. Therefore, in the present preferredembodiment, the electronic component chip 1 can be turned such that theturning path α or the turning path β is reliably drawn. It is thuspossible to reliably turn the electronic component chips 1 by about 90degrees or about 180 degrees.

As the size of the electronic component chips 1 decreases, it becomesmore likely that cracking, chipping, or failure in turning of theelectronic component chips 1 will occur with the method illustrated inFIG. 9A and FIG. 9B. In the present preferred embodiment, however, it ispossible to reliably turn the electronic component chips 1 even if thesize of the electronic component chips 1 decreases.

In the preferred embodiment described above, the second plate 15 ismoved by the planar movement mechanism 19 in the planar direction withrespect to the first plate 12. Alternatively, the first plate 12 may bemoved in the planar direction with respect to the second plate 15, orboth the first and second plates 12 and 15 may be moved in the planardirection. As long as the first and second plates 12 and 15 can berelatively moved in the planar direction, a method and a mechanism formoving the first and second plates 12 and 15 in the planar direction arenot limited to specific ones.

Although the vertical movement mechanism 18 is connected to the firstplate 12 in the preferred embodiment described above, the verticalmovement mechanism 18 may be connected to the second plate 15 or to boththe first and second plates 12 and 15. In other words, the verticalmovement mechanism 18 and the planar movement mechanism 19 can beappropriately modified as long as they can move the first and secondplates 12 and 15 such that the electronic component chips 1 are turnedto draw a predetermined turning path.

While preferred embodiments of the invention have been described above,it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the invention. The scope of the invention, therefore, isto be determined solely by the following claims.

1. An electronic component manufacturing apparatus comprising: a firstplate having a first elastic layer on one side thereof; a second platehaving a second elastic layer on one side thereof; a planar movementmechanism configured to relatively move the first and second plates in aplanar direction thereof in a state where at least one electroniccomponent chip adhering, at one surface thereof, to the first elasticlayer is held between the first and second elastic layers facing eachother; and a vertical movement mechanism configured to move, inconjunction with the planar movement mechanism, at least one of thefirst and second plates in the planar direction and a vertical directionin accordance with a turning path of the electronic component chipturned between the first and second elastic layers.
 2. The electroniccomponent manufacturing apparatus according to claim 1, wherein theplanar movement mechanism and the vertical movement mechanism each havea motor as a drive source and each are provided with a detectingmechanism that detects changes in torque of the motor.
 3. An electroniccomponent manufacturing method using the electronic componentmanufacturing apparatus according to claim 1, the method comprising thesteps of: preparing at least one electronic component chip having afirst surface and a second surface opposite each other; holding theelectronic component chip between the first and second plates such thatthe first and second surfaces are in contact with the first and secondelastic layers, respectively; and turning the electronic component chipby relatively moving the first and second plates in the planar directionusing the planar movement mechanism and moving the first and secondplates in accordance with a turning path of the electronic componentchip using the planar movement mechanism and the vertical movementmechanism.
 4. The electronic component manufacturing method according toclaim 3, further comprising the steps of: before relatively moving thefirst and second plates in the planar direction, bringing the first andsecond plates closer to each other by driving the vertical movementmechanism such that the first and second surfaces of the electroniccomponent chip dig into the first and second elastic layers,respectively; relatively moving the first and second plates in theplanar direction by a predetermined distance smaller than or equal tomaximum displacements of the first and second plates in the verticaldirection, the displacements being made when the first and second platesare brought closer to each other; and after relatively moving the firstand second plates in the planar direction by the predetermined distance,turning the electronic component chip using the planar movementmechanism and the vertical movement mechanism such that the electroniccomponent chip is turned along the turning path of the electroniccomponent chip.
 5. The electronic component manufacturing methodaccording to claim 3, wherein the planar movement mechanism and thevertical movement mechanism each have a motor as a drive source, andeach detect a torque of the motor using a detecting mechanism.